Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /
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| Korporace: | , , |
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| Další autoři: | , , |
| Médium: | Konferenční příspěvek Kniha |
| Jazyk: | English |
| Vydáno: |
New York, N.Y :
American Society of Mechanical Engineers,
c1995.
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| Edice: | EEP (Series) ;
vol. 10. |
| Témata: |