Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /

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Korporace: International Intersociety Electronic Packaging Conference Lahaina, Hawaii, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, Nihon Kikai Gakkai
Další autoři: Hsu, Tai-Ran, Bar-Cohen, Avram, 1946-, Nakayama, Wataru
Médium: Konferenční příspěvek Kniha
Jazyk:English
Vydáno: New York, N.Y : American Society of Mechanical Engineers, c1995.
Edice:EEP (Series) ; vol. 10.
Témata:

CARM 1 Store

Informace o exemplářích z: CARM 1 Store
Signatura: A3:AE23C0 F06317
A3:AE23C0 F06335
Jednotka 1 Dostupné  Požadavek
Jednotka 2 Dostupné  Požadavek