Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /

Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /

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Bibliographic Details
Corporate Authors: International Intersociety Electronic Packaging Conference Lahaina, Hawaii, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, Nihon Kikai Gakkai
Other Authors: Hsu, Tai-Ran, Bar-Cohen, Avram, 1946-, Nakayama, Wataru
Format: Conference Proceeding Book
Language:English
Published: New York, N.Y : American Society of Mechanical Engineers, c1995.
Series:EEP (Series) ; vol. 10.
Subjects:
Electronic packaging > Congresses.
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111 2 |a International Intersociety Electronic Packaging Conference  |d (1995 :  |c Lahaina, Hawaii) 
245 1 0 |a Advances in electronic packaging, 1995 :  |b proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /  |c sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Japan Society of Mechanical Engineers ; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama. 
260 |a New York, N.Y :  |b American Society of Mechanical Engineers,  |c c1995. 
300 |a 2 v. (xvi, 1320 p.) :  |b ill. ;  |c 28 cm. 
490 1 |a EEP ;  |v vol. 10 
504 |a Includes bibliographical references and indexes. 
650 0 |a Electronic packaging  |v Congresses. 
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700 1 |a Bar-Cohen, Avram,  |d 1946- 
700 1 |a Nakayama, Wataru. 
710 2 |a American Society of Mechanical Engineers.  |b Electrical and Electronic Packaging Division. 
710 2 |a Nihon Kikai Gakkai. 
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