Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /

Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii /

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Bibliographic Details
Corporate Authors: International Intersociety Electronic Packaging Conference Lahaina, Hawaii, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, Nihon Kikai Gakkai
Other Authors: Hsu, Tai-Ran, Bar-Cohen, Avram, 1946-, Nakayama, Wataru
Format: Conference Proceeding Book
Language:English
Published: New York, N.Y : American Society of Mechanical Engineers, c1995.
Series:EEP (Series) ; vol. 10.
Subjects:
Electronic packaging > Congresses.
Description
Physical Description:2 v. (xvi, 1320 p.) : ill. ; 28 cm.
Bibliography:Includes bibliographical references and indexes.
ISBN:0791813037 (set)

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