Materials developments in microelectronic packaging : performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress /
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| Corporate Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
Materials Park, Ohio :
ASM International,
c1991.
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| Subjects: |
CARM 1 Store
| Call Number: |
A1:AN22D0 F02622 |
|---|---|
| Copy 1 | Available Place a Hold |