Materials developments in microelectronic packaging : performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress /
Saved in:
| Corporate Authors: | , |
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| 其他作者: | |
| 格式: | Conference Proceeding 圖書 |
| 語言: | English |
| 出版: |
Materials Park, Ohio :
ASM International,
c1991.
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| 主題: |
CARM 1 Store
| 索引號: |
A1:AN22D0 F02622 |
|---|---|
| 復印件 1 | 可用 預訂 |