Materials developments in microelectronic packaging : performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress /
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| Corporate Authors: | , |
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| Other Authors: | |
| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
Materials Park, Ohio :
ASM International,
c1991.
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| Subjects: |
| Physical Description: | xi, 403 p. : ill. ; 29 cm. |
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| Bibliography: | Includes bibliographical references. |
| ISBN: | 0871704358 |