American Society of Mechanical Engineers. Winter Meeting, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, Pecht, M., & Nguyen, L. T. (1993). Electronic packaging reliability: Presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993. American Society of Mechanical Engineers.
Чикаго стиль цитування (17-те видання)American Society of Mechanical Engineers. Winter Meeting, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, Michael Pecht, та Luu T. Nguyen. Electronic Packaging Reliability: Presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993. New York: American Society of Mechanical Engineers, 1993.
Стиль цитування MLA (8-ме видання)American Society of Mechanical Engineers. Winter Meeting, et al. Electronic Packaging Reliability: Presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993. American Society of Mechanical Engineers, 1993.