American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, Fulton, R. E., & Agonafer, D. (1994). CAE/CAD application to electronic packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994. American Society of Mechanical Engineers.
Цитирование в стиле Чикаго (17-е изд.)American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, Robert E. Fulton, и D. Agonafer. CAE/CAD Application to Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994. New York: American Society of Mechanical Engineers, 1994.
Цитирование MLA (8-е изд.)American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, et al. CAE/CAD Application to Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994. American Society of Mechanical Engineers, 1994.