Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 /

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Détails bibliographiques
Collectivités auteurs: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, American Society of Mechanical Engineers. Production Engineering Division, American Society of Mechanical Engineers. Winter Meeting
Autres auteurs: Bennett, T. J. (Timothy J.), Lee, Yung-Cheng
Format: Livre
Langue:English
Publié: New York : The Society, c1992.
Collection:PED (Series) ; vol. 60.
EEP (Series) ; vol. 2.
Sujets:
Description
Description matérielle:v, 211 p. : ill. ; 28 cm.
Bibliographie:Includes bibliographical references and index.
ISBN:0791811123