Results for "Multichip modules (Microelectronics)" Showing 1 - 5 results of 5 Laminas_Feed_Writer 2 (https://getlaminas.org) https://folio.caval.edu.au/Search/Results?sort=last_indexed+desc&limit=50&lookfor=%22Multichip+modules+%28Microelectronics%29%22&type=Subject&lng=en 5 0 50 Routing in the third dimension : from VLSI chips to MCMs / Sun, 01 Jan 1995 08:04:40 +1100 https://folio.caval.edu.au/Record/c000225178 https://folio.caval.edu.au/Record/c000225178 Sherwani, N. A. (Naveed A.) Book 1995 Sherwani, N. A. (Naveed A.) 0 Thermal management handbook : for electronic assemblies / Thu, 01 Jan 1998 08:04:40 +1100 https://folio.caval.edu.au/Record/c000389440 https://folio.caval.edu.au/Record/c000389440 Sergent, Jerry E. Book 1998 Sergent, Jerry E. 0 Area array packaging processes for BGA, Flip Chip, and CSP / Thu, 01 Jan 2004 08:04:40 +1100 https://folio.caval.edu.au/Record/c000389680 https://folio.caval.edu.au/Record/c000389680 Book 2004 0 Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies / Sat, 01 Jan 2000 08:04:40 +1100 https://folio.caval.edu.au/Record/c000389728 https://folio.caval.edu.au/Record/c000389728 Lau, John H. Book 2000 Lau, John H. 0 Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia / Mon, 01 Jan 1996 08:04:40 +1100 https://folio.caval.edu.au/Record/c000291613 https://folio.caval.edu.au/Record/c000291613 Conference Proceeding Book 1996 0