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  1. 1
    Routing in the third dimension : from VLSI chips to MCMs /
    图书
    由 Sherwani, N. A. (Naveed A.)
    出版 1995
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  2. 2
    Thermal management handbook : for electronic assemblies /
    图书
    由 Sergent, Jerry E.
    出版 1998
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  3. 3
    Area array packaging processes for BGA, Flip Chip, and CSP /
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    出版 2004
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  4. 4
    Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /
    图书
    由 Lau, John H.
    出版 2000
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  5. 5
    Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
    会议录 图书
    出版 1996
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