在您的搜尋 主題建議
Showing 1 - 5 results of 5 for search '', 查詢時間: 0.01s Refine Results
  1. 1
    Routing in the third dimension : from VLSI chips to MCMs /
    圖書
    由 Sherwani, N. A. (Naveed A.)
    出版 1995
    加到收藏夾
    Saved in:
  2. 2
    Thermal management handbook : for electronic assemblies /
    圖書
    由 Sergent, Jerry E.
    出版 1998
    Publisher description
    Table of contents
    Contributor biographical information
    加到收藏夾
    Saved in:
  3. 3
    Area array packaging processes for BGA, Flip Chip, and CSP /
    圖書
    出版 2004
    Contributor biographical information
    Table of contents
    Publisher description
    加到收藏夾
    Saved in:
  4. 4
    Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /
    圖書
    由 Lau, John H.
    出版 2000
    Table of contents
    Publisher description
    Contributor biographical information
    加到收藏夾
    Saved in:
  5. 5
    Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
    Conference Proceeding 圖書
    出版 1996
    加到收藏夾
    Saved in:
檢索工具: 得到RSS訂閱 – 推薦此搜索 – 保存搜索