Topaicí molta laistigh de do chuardach.
1 - 5 toradh á dtaispeáint as 5 toradh san iomlán ar an gcuardach '', am iarratais: 0.01s Beachtaigh na torthaí
  1. 1
    Routing in the third dimension : from VLSI chips to MCMs /
    LEABHAR
    de réir Sherwani, N. A. (Naveed A.)
    Foilsithe / Cruthaithe 1995
    Cuir le mo chuid Ceanán
    Sábháilte in:
  2. 2
    Thermal management handbook : for electronic assemblies /
    LEABHAR
    de réir Sergent, Jerry E.
    Foilsithe / Cruthaithe 1998
    Publisher description
    Table of contents
    Contributor biographical information
    Cuir le mo chuid Ceanán
    Sábháilte in:
  3. 3
    Area array packaging processes for BGA, Flip Chip, and CSP /
    LEABHAR
    Foilsithe / Cruthaithe 2004
    Contributor biographical information
    Table of contents
    Publisher description
    Cuir le mo chuid Ceanán
    Sábháilte in:
  4. 4
    Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /
    LEABHAR
    de réir Lau, John H.
    Foilsithe / Cruthaithe 2000
    Table of contents
    Publisher description
    Contributor biographical information
    Cuir le mo chuid Ceanán
    Sábháilte in:
  5. 5
    Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia /
    Imeacht comhdhála LEABHAR
    Foilsithe / Cruthaithe 1996
    Cuir le mo chuid Ceanán
    Sábháilte in:
Uirlisí cuardaigh: Faigh fotha RSS – Seol an cuardach seo mar r-phost – Sábháil an cuardach