Electronics manufacturing : with lead-free, halogen free, and conductive adhesive materials /
Gorde:
| Beste egile batzuk: | |
|---|---|
| Formatua: | Liburua |
| Hizkuntza: | English |
| Argitaratua: |
New York ; London :
McGraw-Hill,
c2003.
|
| Saila: | McGraw-Hill handbooks
|
| Gaiak: | |
| Sarrera elektronikoa: | Table of contents Publisher description Contributor biographical information |
Aurkibidea:
- Ch. 1. Introduction to Environmentally Benign Electronics Manufacturing
- Ch. 2. Chip (Wafer)-Level Interconnects with Lead-Free Solder Bumps
- Ch. 3. WLCSP with Lead-Free Solder Bumps on PCB/Substrate
- Ch. 4. Chip (Wafer)-Level Interconnects with Solderless Bumps
- Ch. 5. WLCSP with Solderless Bumps on PCB/Substrate
- Ch. 6. Environmentally Benign Molding Compounds for IC Packages
- Ch. 7. Environmentally Benign Die Attach Films for IC Packaging
- Ch. 8. Environmental Issues for Conventional PCBs
- Ch. 9. Halogenated and Halogen-Free Materials for Flame Retardation
- Ch. 10. Fabrication of Environmentally Friendly PCB
- Ch. 11. Global Status of Lead-Free Soldering
- Ch. 12. Development of Lead-Free Solder Alloys
- Ch. 13. Prevailing Lead-Free Alloys
- Ch. 14. Lead-Free Surface Finishes
- Ch. 15. Implementation of Lead-Free Soldering
- Ch. 16. Challenges for Lead-Free Soldering
- Ch. 17. Introduction to Conductive Adhesives.
- Ch. 18. Conductivity Establishment of Conductive Adhesives
- Ch. 19. Mechanisms Underlying the Unstable Contact Resistance of ECAs
- Ch. 20. Stabilization of Contact Resistance of Conductive Adhesives.