American Society of Mechanical Engineers. Heat Transfer Division, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition, & Amon, C. H. (1995). Cooling and thermal design of electronic systems: Presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California. American Society of Mechanical Engineers.

American Society of Mechanical Engineers. Heat Transfer Division, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition, and Cristina H. Amon. Cooling and Thermal Design of Electronic Systems: Presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California. New York: American Society of Mechanical Engineers, 1995.

American Society of Mechanical Engineers. Heat Transfer Division, et al. Cooling and Thermal Design of Electronic Systems: Presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California. American Society of Mechanical Engineers, 1995.