Area array packaging processes for BGA, Flip Chip, and CSP /
Gorde:
| Beste egile batzuk: | |
|---|---|
| Formatua: | Liburua |
| Hizkuntza: | English |
| Argitaratua: |
New York ; London :
McGraw-Hill,
c2004.
|
| Gaiak: | |
| Sarrera elektronikoa: | Contributor biographical information Table of contents Publisher description |
| Alearen deskribapena: | Formerly CIP. |
|---|---|
| Deskribapen fisikoa: | x, 260 p. : ill. ; 25 cm. |
| Bibliografia: | Includes bibliographical references and index. |
| ISBN: | 0071428291 (acid-free paper) |