Thermal management handbook : for electronic assemblies /
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| Main Author: | |
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| Other Authors: | |
| Format: | Book |
| Language: | English |
| Published: |
New York :
McGraw-Hill,
1998.
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| Series: | Electronic packaging and interconnection series
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| Subjects: | |
| Online Access: | Publisher description Table of contents Contributor biographical information |
Table of Contents:
- Machine derived contents note: Introduction.
- Electronic Packaging Technology.
- Thermal Properties of Electronic Materials.
- Heat Generation in Electronic Circuits.
- Basic Thermal Analysis.
- Thermal Analysis of Electronic Assemblies.
- Cooling of Electronic Assemblies.
- Data.