Cita APA

Lau, J. H. (1993). Thermal stress and strain in microelectronics packaging. Van Nostrand Reinhold.

Citación estilo Chicago

Lau, John H. Thermal Stress and Strain in Microelectronics Packaging. New York: Van Nostrand Reinhold, 1993.

Cita MLA

Lau, John H. Thermal Stress and Strain in Microelectronics Packaging. Van Nostrand Reinhold, 1993.

Warning: These citations may not always be 100% accurate.