APA (7th ed.) Citation

Lau, J. H. (1993). Thermal stress and strain in microelectronics packaging. Van Nostrand Reinhold.

Chicago Style (17th ed.) Citation

Lau, John H. Thermal Stress and Strain in Microelectronics Packaging. New York: Van Nostrand Reinhold, 1993.

MLA (8th ed.) Citation

Lau, John H. Thermal Stress and Strain in Microelectronics Packaging. Van Nostrand Reinhold, 1993.