Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993 /

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Bibliographic Details
Corporate Authors: National Heat Transfer Conference Atlanta, Ga., American Society of Mechanical Engineers. Heat Transfer Division
Other Authors: Agonafer, D.
Format: Conference Proceeding Book
Language:English
Published: New York, N.Y. : American Society of Mechanical Engineers, c1993.
Series:HTD (Series) ; v. 255.
Subjects:
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111 2 |a National Heat Transfer Conference  |n (29th :  |d 1993 :  |c Atlanta, Ga.) 
245 1 0 |a Solutions to CFD benchmark problems in electronic packaging :  |b presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993 /  |c sponsored by the Heat Transfer Division, ASME ; edited by Dereje Agonafer. 
260 |a New York, N.Y. :  |b American Society of Mechanical Engineers,  |c c1993. 
300 |a v, 57 p. :  |b ill. ;  |c 28 cm. 
490 1 |a HTD ;  |v vol. 255 
504 |a Includes bibliographical references and index. 
650 0 |a Electronic packaging  |v Congresses. 
650 0 |a Fluid dynamics  |x Data processing  |v Congresses. 
700 1 |a Agonafer, D. 
710 2 |a American Society of Mechanical Engineers.  |b Heat Transfer Division 
830 0 |a HTD (Series) ;  |v v. 255. 
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