HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /
Gardado en:
| Autor Principal: | |
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| Autor Corporativo: | |
| Formato: | Libro |
| Idioma: | English |
| Publicado: |
Gaithersburg, MD : Washington, DC :
U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O.,
1995.
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| Series: | NIST special publication ;
400-96. Semiconductor measurement technology. |
| Subjects: |
CARM 1 Store
| Número de Clasificación: |
A3:AE21D0 F06324 |
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| Copia 1 | Dispoñible Facer reserva |