Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
Saved in:
企业作者: | , |
---|---|
其他作者: | , |
格式: | 会议录 图书 |
语言: | English |
出版: |
New York :
American Society of Mechanical Engineers,
c1993.
|
丛编: | EEP (Series) ;
vol. 4. |
主题: |