Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /

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企业作者: ASME International Electronics Packaging Conference Binghamton, N.Y., American Society of Mechanical Engineers
其他作者: Chen, William T., Engel, Peter A.
格式: 会议录 图书
语言:English
出版: New York : American Society of Mechanical Engineers, c1993.
丛编:EEP (Series) ; vol. 4.
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