Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /

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Bibliographic Details
Corporate Authors: ASME International Electronics Packaging Conference Binghamton, N.Y., American Society of Mechanical Engineers
Other Authors: Chen, William T., Engel, Peter A.
Format: Conference Proceeding Book
Language:English
Published: New York : American Society of Mechanical Engineers, c1993.
Series:EEP (Series) ; vol. 4.
Subjects:

CARM 1 Store

Holdings details from CARM 1 Store
Call Number: A3:AE23C0 F06317
A3:AE24C0 F06320
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