Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
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| Korporace: | , |
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| Další autoři: | , |
| Médium: | Konferenční příspěvek Kniha |
| Jazyk: | English |
| Vydáno: |
New York :
American Society of Mechanical Engineers,
c1993.
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| Edice: | EEP (Series) ;
vol. 4. |
| Témata: |