Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
Shranjeno v:
Corporate Authors: | , |
---|---|
Drugi avtorji: | , |
Format: | Conference Proceeding Knjiga |
Jezik: | English |
Izdano: |
New York :
American Society of Mechanical Engineers,
c1993.
|
Serija: | EEP (Series) ;
vol. 4. |
Teme: |
Kazalo:
- v. 1. Structural analysis, materials and processes, design, reliability
- v. 2. Thermal management, solder technology, optoelectronics packaging.