Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /

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Корпоративные авторы: ASME International Electronics Packaging Conference Binghamton, N.Y., American Society of Mechanical Engineers
Другие авторы: Chen, William T., Engel, Peter A.
Формат: Материалы конференции
Язык:English
Опубликовано: New York : American Society of Mechanical Engineers, c1993.
Серии:EEP (Series) ; vol. 4.
Предметы:
Оглавление:
  • v. 1. Structural analysis, materials and processes, design, reliability
  • v. 2. Thermal management, solder technology, optoelectronics packaging.