Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
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Корпоративные авторы: | , |
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Другие авторы: | , |
Формат: | Материалы конференции |
Язык: | English |
Опубликовано: |
New York :
American Society of Mechanical Engineers,
c1993.
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Серии: | EEP (Series) ;
vol. 4. |
Предметы: |
Оглавление:
- v. 1. Structural analysis, materials and processes, design, reliability
- v. 2. Thermal management, solder technology, optoelectronics packaging.