Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
Na minha lista:
| Autores corporativos: | , |
|---|---|
| Outros Autores: | , |
| Formato: | Anais de Congresso Livro |
| Idioma: | English |
| Publicado em: |
New York :
American Society of Mechanical Engineers,
c1993.
|
| coleção: | EEP (Series) ;
vol. 4. |
| Assuntos: |
Sumário:
- v. 1. Structural analysis, materials and processes, design, reliability
- v. 2. Thermal management, solder technology, optoelectronics packaging.