Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
Bewaard in:
| Coauteurs: | , |
|---|---|
| Andere auteurs: | , |
| Formaat: | Conferentie akten Boek |
| Taal: | English |
| Gepubliceerd in: |
New York :
American Society of Mechanical Engineers,
c1993.
|
| Reeks: | EEP (Series) ;
vol. 4. |
| Onderwerpen: |
Inhoudsopgave:
- v. 1. Structural analysis, materials and processes, design, reliability
- v. 2. Thermal management, solder technology, optoelectronics packaging.