Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
Gardado en:
| Corporate Authors: | , |
|---|---|
| Outros autores: | , |
| Formato: | Conference Proceeding Libro |
| Idioma: | English |
| Publicado: |
New York :
American Society of Mechanical Engineers,
c1993.
|
| Series: | EEP (Series) ;
vol. 4. |
| Subjects: |
Table of Contents:
- v. 1. Structural analysis, materials and processes, design, reliability
- v. 2. Thermal management, solder technology, optoelectronics packaging.