Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
Guardado en:
| Autores Corporativos: | , |
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| Otros Autores: | , |
| Formato: | Procedimiento de la Conferencia Libro |
| Lenguaje: | English |
| Publicado: |
New York :
American Society of Mechanical Engineers,
c1993.
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| Colección: | EEP (Series) ;
vol. 4. |
| Materias: |
Tabla de Contenidos:
- v. 1. Structural analysis, materials and processes, design, reliability
- v. 2. Thermal management, solder technology, optoelectronics packaging.