Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
Guardat en:
| Autor corporatiu: | , |
|---|---|
| Altres autors: | , |
| Format: | Actes de congresos Llibre |
| Idioma: | English |
| Publicat: |
New York :
American Society of Mechanical Engineers,
c1993.
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| Col·lecció: | EEP (Series) ;
vol. 4. |
| Matèries: |
Taula de continguts:
- v. 1. Structural analysis, materials and processes, design, reliability
- v. 2. Thermal management, solder technology, optoelectronics packaging.