Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
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| Corporate Authors: | , |
|---|---|
| 其他作者: | , |
| 格式: | Conference Proceeding 圖書 |
| 語言: | English |
| 出版: |
New York :
American Society of Mechanical Engineers,
c1993.
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| 叢編: | EEP (Series) ;
vol. 4. |
| 主題: |