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01900cam a2200361 a 4500 |
| 001 |
c000291311 |
| 003 |
CARM |
| 005 |
20090430130201.0 |
| 008 |
940304s1993 nyua b 101 0 eng d |
| 010 |
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|a 94126196
|
| 019 |
1 |
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|a 10902670
|5 LACONCORD2021
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| 020 |
|
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|a 0791806863 (set)
|
| 035 |
|
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|a (OCoLC)30319549
|5 LACONCORD2021
|
| 040 |
|
|
|a LC
|b eng
|c LC
|d LC
|d VCAV
|
| 050 |
0 |
0 |
|a TK7870.15
|b .A83 1993
|
| 082 |
0 |
4 |
|a 621.381046
|2 20
|
| 111 |
2 |
|
|a ASME International Electronics Packaging Conference
|n (2nd :
|d 1993 :
|c Binghamton, N.Y.)
|
| 245 |
1 |
0 |
|a Advances in electronic packaging, 1993 :
|b proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 /
|c sponsored by the American Society of Mechanical Engineers ; edited by Peter A. Engel, William T. Chen.
|
| 260 |
|
|
|a New York :
|b American Society of Mechanical Engineers,
|c c1993.
|
| 300 |
|
|
|a 2 v. (xi, 1200 p.) :
|b ill. ;
|c 28 cm.
|
| 490 |
1 |
|
|a EEP ;
|v vol. 4
|
| 504 |
|
|
|a Includes bibliographical references and indexes.
|
| 505 |
0 |
|
|a v. 1. Structural analysis, materials and processes, design, reliability -- v. 2. Thermal management, solder technology, optoelectronics packaging.
|
| 650 |
|
0 |
|a Electronic packaging
|v Congresses.
|
| 700 |
1 |
|
|a Chen, William T.
|
| 700 |
1 |
|
|a Engel, Peter A.
|
| 710 |
2 |
|
|a American Society of Mechanical Engineers.
|
| 830 |
|
0 |
|a EEP (Series) ;
|v vol. 4.
|
| 852 |
8 |
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|b CARM
|h A3:AE23C0
|i F06317
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|f BK
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| 852 |
8 |
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|b CARM
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|i F06320
|p 0527297
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f |
f |
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|s 317a6a84-5453-5801-ab12-5b19a1754093
|
| 952 |
f |
f |
|p Can circulate
|a CAVAL
|b CAVAL
|c CAVAL
|d CARM 1 Store
|e F06320
|f A3:AE24C0
|h Other scheme
|i book
|j v.2
|m 0527297
|
| 952 |
f |
f |
|p Can circulate
|a CAVAL
|b CAVAL
|c CAVAL
|d CARM 1 Store
|e F06317
|f A3:AE23C0
|h Other scheme
|i book
|j v.1
|m 0527296
|