APA引文

ASME International Electronics Packaging Conference Binghamton, N.Y., American Society of Mechanical Engineers, Chen, W. T., & Engel, P. A. (1993). Advances in electronic packaging, 1993: Proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993. American Society of Mechanical Engineers.

Chicago Style (17th ed.) Citation

ASME International Electronics Packaging Conference Binghamton, N.Y., American Society of Mechanical Engineers, William T. Chen, and Peter A. Engel. Advances in Electronic Packaging, 1993: Proceedings of the 1993 ASME International Electronics Packaging Conference : Presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993. New York: American Society of Mechanical Engineers, 1993.

MLA引文

ASME International Electronics Packaging Conference Binghamton, N.Y., et al. Advances in Electronic Packaging, 1993: Proceedings of the 1993 ASME International Electronics Packaging Conference : Presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993. American Society of Mechanical Engineers, 1993.