ASME International Electronics Packaging Conference Binghamton, N.Y., American Society of Mechanical Engineers, Chen, W. T., & Engel, P. A. (1993). Advances in electronic packaging, 1993: Proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993. American Society of Mechanical Engineers.
Чикаго стиль цитування (17-те видання)ASME International Electronics Packaging Conference Binghamton, N.Y., American Society of Mechanical Engineers, William T. Chen, та Peter A. Engel. Advances in Electronic Packaging, 1993: Proceedings of the 1993 ASME International Electronics Packaging Conference : Presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993. New York: American Society of Mechanical Engineers, 1993.
Стиль цитування MLA (8-ме видання)ASME International Electronics Packaging Conference Binghamton, N.Y., et al. Advances in Electronic Packaging, 1993: Proceedings of the 1993 ASME International Electronics Packaging Conference : Presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993. American Society of Mechanical Engineers, 1993.