International Intersociety Electronic Packaging Conference Lahaina, Hawaii, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, Nihon Kikai Gakkai, Hsu, T., Bar-Cohen, A., & Nakayama, W. (1995). Advances in electronic packaging, 1995: Proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii. American Society of Mechanical Engineers.
Chicagoスタイル(17版)引用形式International Intersociety Electronic Packaging Conference Lahaina, Hawaii, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, Nihon Kikai Gakkai, Tai-Ran Hsu, Avram Bar-Cohen, , Wataru Nakayama. Advances in Electronic Packaging, 1995: Proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : Presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii. New York, N.Y: American Society of Mechanical Engineers, 1995.
MLA(8版)引用形式International Intersociety Electronic Packaging Conference Lahaina, Hawaii, et al. Advances in Electronic Packaging, 1995: Proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : Presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii. American Society of Mechanical Engineers, 1995.