Materials developments in microelectronic packaging : performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress /

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Bibliographic Details
Corporate Authors: Electronic Materials and Processing Congress Montréal, Québec, ASM International. Electronic Materials and Processing Division
Other Authors: Singh, Prabjit
Format: Conference Proceeding Book
Language:English
Published: Materials Park, Ohio : ASM International, c1991.
Subjects:
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111 2 |a Electronic Materials and Processing Congress  |n (4th :  |d 1991 :  |c Montréal, Québec) 
245 1 0 |a Materials developments in microelectronic packaging :  |b performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress /  |c sponsored by the Electronic Materials and Processing Division of ASM International ; edited by Prabjit Singh. 
260 |a Materials Park, Ohio :  |b ASM International,  |c c1991. 
300 |a xi, 403 p. :  |b ill. ;  |c 29 cm. 
504 |a Includes bibliographical references. 
650 0 |a Microelectronic packaging  |x Materials  |x Testing  |v Congresses. 
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710 2 |a ASM International.  |b Electronic Materials and Processing Division. 
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