Materials developments in microelectronic packaging : performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress /
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| 企业作者: | , |
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| 其他作者: | |
| 格式: | 会议录 图书 |
| 语言: | English |
| 出版: |
Materials Park, Ohio :
ASM International,
c1991.
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| 主题: |
| 实物描述: | xi, 403 p. : ill. ; 29 cm. |
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| 参考书目: | Includes bibliographical references. |
| ISBN: | 0871704358 |