APA引文

Electronic Materials and Processing Congress Montréal, Québec, ASM International. Electronic Materials and Processing Division, & Singh, P. (1991). Materials developments in microelectronic packaging: Performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress. ASM International.

Chicago Style (17th ed.) Citation

Electronic Materials and Processing Congress Montréal, Québec, ASM International. Electronic Materials and Processing Division, and Prabjit Singh. Materials Developments in Microelectronic Packaging: Performance and Reliability : Proceedings of the Fourth Electronic Materials and Processing Congress. Materials Park, Ohio: ASM International, 1991.

MLA引文

Electronic Materials and Processing Congress Montréal, Québec, et al. Materials Developments in Microelectronic Packaging: Performance and Reliability : Proceedings of the Fourth Electronic Materials and Processing Congress. ASM International, 1991.