Electronic Materials and Processing Congress Montréal, Québec, ASM International. Electronic Materials and Processing Division, & Singh, P. (1991). Materials developments in microelectronic packaging: Performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress. ASM International.
Citace podle Chicago (17th ed.)Electronic Materials and Processing Congress Montréal, Québec, ASM International. Electronic Materials and Processing Division, a Prabjit Singh. Materials Developments in Microelectronic Packaging: Performance and Reliability : Proceedings of the Fourth Electronic Materials and Processing Congress. Materials Park, Ohio: ASM International, 1991.
Citace podle MLA (8th ed.)Electronic Materials and Processing Congress Montréal, Québec, et al. Materials Developments in Microelectronic Packaging: Performance and Reliability : Proceedings of the Fourth Electronic Materials and Processing Congress. ASM International, 1991.