Dyfyniad APA

Electronic Materials and Processing Congress Montréal, Québec, ASM International. Electronic Materials and Processing Division, & Singh, P. (1991). Materials developments in microelectronic packaging: Performance and reliability : proceedings of the fourth Electronic Materials and Processing Congress. ASM International.

Dyfyniad Arddull Chicago

Electronic Materials and Processing Congress Montréal, Québec, ASM International. Electronic Materials and Processing Division, and Prabjit Singh. Materials Developments in Microelectronic Packaging: Performance and Reliability : Proceedings of the Fourth Electronic Materials and Processing Congress. Materials Park, Ohio: ASM International, 1991.

Dyfyniad MLA

Electronic Materials and Processing Congress Montréal, Québec, et al. Materials Developments in Microelectronic Packaging: Performance and Reliability : Proceedings of the Fourth Electronic Materials and Processing Congress. ASM International, 1991.

Rhybudd: Mae'n bosib nad yw'r dyfyniadau hyn bob amser yn 100% cywir.