Effect of bonded insert shape and adhesive thickness on critical stresses in a loaded plate /
This report presents the results of finite element analyses conducted to calculate the magnitude of adhesive stresses for a large plate with a bonded insert, and study the interaction of key parameters including (i) insert shape, and (ii) adhesive modulus and thickness, with maximum plate stresses....
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| Main Author: | |
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| Corporate Authors: | , |
| Other Authors: | |
| Format: | Book |
| Language: | English |
| Published: |
Melbourne, Vic. :
DSTO Aeronautical and Maritime Research Laboratory,
1996.
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| Series: | Technical report (Defence Science and Technology Organisation (Australia)) ;
DSTO-TR-0409. |
| Subjects: | |
| Online Access: | http://www.dsto.defence.gov.au/corporate/reports/DSTO-TR-0409.pdf |
| Summary: | This report presents the results of finite element analyses conducted to calculate the magnitude of adhesive stresses for a large plate with a bonded insert, and study the interaction of key parameters including (i) insert shape, and (ii) adhesive modulus and thickness, with maximum plate stresses. Results are presented for circular, oval and elliptical insert cases. It is shown that changing the key variables can improve the efficiency of such repairs; however, due to typically high adhesive stresses, careful consideration must be given to the level of applied loading and the design of the insert chose. In general, for a particular shape of reinforcement, there is a trade-off between plate and adhesive stress magnitudes. This relationship is such that minimising adhesive stresses (through increasing adhesive thickness or reducing adhesive modulus) reduces the beneficial effect on plate stresses of the bonded reinforcement. It is shown that for circular inserts this relationship is essentially linear. |
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| Item Description: | "August 1996". "AR No.AR-009-875"-verso t.p. |
| Physical Description: | 28 p. : ill. ; 30 cm. Also available in PDF format via the World Wide Web. |
| Bibliography: | Includes bibliographical references (p. 10) |